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Does Teradyne sponsor H-1B for Software Engineering?
Yes — Teradyne files H-1B paperwork and hires software engineering.
Teradyne filed 64 Labor Condition Applications company-wide in FY2025–26
— about 19 for titles related to software engineering (median filed salary $148,789).
No open software engineering jobs are tracked right now.
0open software engineering jobs
19related LCA filings
$148,789median related salary
64company LCA filings
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No open software engineering jobs tracked right now. Get notified when Teradyne posts one.
Software Engineering salaries Teradyne filed
Related job titles from US DOL LCA filings (FY2025–FY2026), matched by title keywords — not a guarantee for any specific opening.
| Job title | Filings | Median salary |
|---|---|---|
| Semiconductor Design Engineer | 6 | $127,252 |
| Software Engineer | 5 | $146,261 |
| Field Application Engineer | 4 | $173,889 |
| Applications Engineer | 4 | $159,154 |
More at Teradyne
Full Teradyne H-1B sponsorship page · All Software Engineering jobs at H-1B sponsors
Filing history shows an employer sponsors in general; it doesn't guarantee a specific role is sponsored. Title-family matching is heuristic. How we build this data · Request a correction