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Does Dish Wireless sponsor H-1B for Software Engineering?
Yes — Dish Wireless files H-1B paperwork and hires software engineering.
Dish Wireless filed 421 Labor Condition Applications company-wide in FY2025–26
— about 43 for titles related to software engineering (median filed salary $112,475).
No open software engineering jobs are tracked right now.
0open software engineering jobs
43related LCA filings
$112,475median related salary
421company LCA filings
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No open software engineering jobs tracked right now. Get notified when Dish Wireless posts one.
Software Engineering salaries Dish Wireless filed
Related job titles from US DOL LCA filings (FY2025–FY2026), matched by title keywords — not a guarantee for any specific opening.
| Job title | Filings | Median salary |
|---|---|---|
| Staff Engineer - Software | 8 | $137,207 |
| Senior Engineer - Software | 7 | $120,536 |
| Engineer Ii - Software | 6 | $101,057 |
| Engineer Ii - Wireless | 6 | $105,362 |
| Engineer I - Wireless | 6 | $81,796 |
| Senior Software Engineer | 5 | $117,021 |
| Senior Engineer - Wireless | 5 | $116,126 |
More at Dish Wireless
Full Dish Wireless H-1B sponsorship page · All Software Engineering jobs at H-1B sponsors
Filing history shows an employer sponsors in general; it doesn't guarantee a specific role is sponsored. Title-family matching is heuristic. How we build this data · Request a correction